한국전기전자재료학회:학술대회논문집 (Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference)
- 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
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- Pages.653-654
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- 2005
Cu CMP에서 스틱-슬립 마찰과 스크래치에 관한 연구
A Study on Stick-slip Friction and Scratch in Cu CMP
-
이현섭
(부산대학교 정밀기계공학과)
;
-
박범영
(부산대학교 정밀기계공학과)
;
- 정석훈 (부산대학교 정밀기계공학과) ;
- 정재우 (부산대학교 정밀기계공학과) ;
-
서헌덕
(부산대학교 정밀기계공학과)
;
-
정해도
(부산대학교 기계공학부)
-
Lee, Hyun-Seop
(Department of Mechanical & Precision Engineering in PNU)
;
-
Park, Boum-Young
(Department of Mechanical & Precision Engineering in PNU)
;
- Jeong, Suk-Hoon (Department of Mechanical & Precision Engineering in PNU) ;
- Jeong, Jae-Woo (Department of Mechanical & Precision Engineering in PNU) ;
-
Seo, Heon-Deok
(Department of Mechanical & Precision Engineering in PNU)
;
-
Jeong, Hae-Do
(School of Mechanical Engineering in PNU)
- 발행 : 2005.07.07
초록
Stick-slip friction is one of the material removal mechanisms in tribology. This stick-slip friction occurs when the static friction force is larger than the dynamic friction force, and make the friction curve fluctuated. In the friction force monitoring system for chemical mechanical polishing(CMP), the friction force also vibrates just as stick-slip friction. It seems that the stick-slip friction causes scratches on the surface of moving parts. In this paper, A study on the scratches which occur during copper CMP was conducted in a view of stick-slip friction.