한국전기전자재료학회:학술대회논문집 (Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference)
- 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
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- Pages.357-358
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- 2005
LTCC를 이용한 Small Size Dual Band PAM의 구현
Implementation of Small Size Dual Band PAM using LTCC Substrates
- 신용길 (전자부품연구원) ;
- 정현철 (전자부품연구원) ;
- 이중근 (전자부품연구원) ;
- 김동수 (전자부품연구원) ;
- 유찬세 (전자부품연구원) ;
- 유명재 (전자부품연구원) ;
- 박성대 (전자부품연구원) ;
- 이우성 (전자부품연구원)
- Shin, Yong-Kil (Electronic Materials & Packaging Research Center, Korea Electronics Technology Institute) ;
- Chung, Hyun-Chul (Electronic Materials & Packaging Research Center, Korea Electronics Technology Institute) ;
- Lee, Joon-Geun (Electronic Materials & Packaging Research Center, Korea Electronics Technology Institute) ;
- Kim, Dong-Su (Electronic Materials & Packaging Research Center, Korea Electronics Technology Institute) ;
- Yoo, Jo-Shua (Electronic Materials & Packaging Research Center, Korea Electronics Technology Institute) ;
- Yoo, Myong-Jae (Electronic Materials & Packaging Research Center, Korea Electronics Technology Institute) ;
- Park, Seong-Dae (Electronic Materials & Packaging Research Center, Korea Electronics Technology Institute) ;
- Lee, Woo-Sung (Electronic Materials & Packaging Research Center, Korea Electronics Technology Institute)
- 발행 : 2005.07.07
초록
Compact power amplifier modules (PAM) for WCDMA/KPCS and GSM/WCDMA dual-band applications based on multilayer low temperature co-fired ceramic (LTCC) substrates are presented in this paper. The proposed modules are composed of an InGaP/GaAs HBT PAs on top of the LTCC substrates and passive components such as RF chokes and capacitors which are embedded in the substrates. The overall size of the modules is less than 6mm