Study on variation of electrical properties of polymer thick film resistor regarding curing temperature, printing process and substrate

경화 온도와 인쇄 공정 및 기판에 따른 폴리머 후막 저항체의 특성 변화에 대한 연구

  • 유명재 (전자소재패키징센터, 전자부품연구원) ;
  • 이상명 (전자소재패키징센터, 전자부품연구원) ;
  • 박성대 (전자소재패키징센터, 전자부품연구원) ;
  • 이우성 (전자소재패키징센터, 전자부품연구원) ;
  • 강남기 (전자소재패키징센터, 전자부품연구원)
  • Published : 2005.07.07

Abstract

Applying a designed test coupon pattern for fabricating resistors various resistors were formed using PTF(polymer thick film) pastes. Aspect ratio from 0.25 to 4 were selected for fabricating resistors. Formed resistors were cured at $170^{\circ}C$ and $240^{\circ}C$. Electrical properties of fabricated resistors were measured and their values analyzed in relation to cure temperature and formed geometry via printing. Also effects of substrates used for fabricating resistors were observed.

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