한국전기전자재료학회:학술대회논문집 (Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference)
- 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
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- Pages.147-148
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- 2005
IGBT을 위한 열 특성 모델링
Modeling of Thermal Characteristics for IGBT
- Ryu, Se-Hwan (Konkuk Univ.) ;
- Hwang, Kwang-Chul (Konkuk Univ.) ;
- Yu, Young-Han (Konkuk Univ.) ;
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Ahn, Hyung-Keun
(Konkuk Univ.) ;
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Han, Deuk-Young
(Konkuk Univ.)
- 발행 : 2005.07.07
초록
As the power density and switching frequency increase, thermal analysis of power electronics system becomes imperative. The analysis provides valuable information on the semiconductor rating, long-term reliability and efficient heat-sink design. In this paper, thermal distribution of the Insulated Gate Bipolar Transistor Module has been studied with different conditions and heat sink materials. For analysis of thermal distribution, we obtained results by using finite element simulator, Ansys.