한국반도체및디스플레이장비학회:학술대회논문집 (Proceedings of the Korean Society Of Semiconductor Equipment Technology)
- 한국반도체및디스플레이장비학회 2005년도 춘계 학술대회
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- Pages.219-223
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- 2005
레이저를 이용한 LCD 유리 절단 기술
- Jeong, Jae-Yong (ESSELTICH Co., Ltd.) ;
- O, Dae-Hyeon (K-eng Co. Ltd.) ;
- Yu, Gi-Ryong (Rorze Systems Corp.) ;
- Lee, Cheon (INHA Univ.) ;
- Lee, U-Yeong (KUT)
- 발행 : 2005.05.01
초록
Nowadays laser cutting is the most promising method of cutting FPD(Flat Panel Display) glass in mass-production line. And this method can also be used to cut other brittle materials such as quartz, sapphire, ceramic and semiconductor The concept of this method is shown in picture 1. Laser beam heats glass up to strain point, not to melting point and cooling system chills glass to induce maximun thermal stress in glass surface and then the thermal stress generates micro thermal crack, in other words blind depth of crack, along laser beam and cooling line.
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