한국마이크로전자및패키징학회:학술대회논문집 (Proceedings of the International Microelectronics And Packaging Society Conference)
- 한국마이크로전자및패키징학회 2005년도 ISMP
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- Pages.213-230
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- 2005
Wafer Level Package Technology Applied to System Packaging
- Wakabayashi Takeshi (Advanced Packaging Technology Dep. Core Technologies R&D Division Casio Computer Co., LTD.)
- 발행 : 2005.09.01