Simulation of Etching Characteristics with Oscillation Angle in Etching System

에칭시스템에서 요동각 변화에 따른 에칭특성 시뮬레이션

The objective of this study is to simulate the etching characteristics with oscillation angle for the optimization of etching system. The etching characteristics were analyzed under different etching conditions. The spray characteristics were measured by Phase Doppler Anemometer (PDA). The correlation between the spray characteristics and the etching characteristics was investigated and used for fundamental data to simulate the etching characteristics with oscillation angle. The smaller coefficient of variation, the more uniform etching characteristic distribution became. It was found that numerical predictions of etching factor generally agreed well with the measured results with distance from nozzle tip. Oscillation leads to decrease of etching factor and increase of uniformity.