한국정밀공학회:학술대회논문집 (Proceedings of the Korean Society of Precision Engineering Conference)
- 한국정밀공학회 2004년도 추계학술대회 논문집
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- Pages.1376-1379
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- 2004
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- 2005-8446(pISSN)
DeviceNet 을 채용한 GaAs 본딩 시스템의 통합 제어기술
Integration and Control Technology of GaAs Bonding System using DeviceNet
초록
This study is designed integration and control system of GaAs bonding system consisted of multi-processing using DeviceNet and GEM-Protocol. Developing bonding system is composed of resin coating, pre-baking pre-aligner, bonding, material handler(flip robot), and wafer cassette, etc. This system has process-fluent of each a process and share information using GEM-protocol. This study devised virtual bonding simulator to control and to monitor bonding system efficiently. Also we can verify optimizing of system previously through a virtual bonding simulator.