Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)
- 2004.11a
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- Pages.70-70
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- 2004
Copper Via Filling for SIP by Pulse Reverse Electroplating
- Bae Jin-Soo (Dept. of Materials Science & Engineering, HongIk University) ;
- Lee Jae-Ho (Dept. of Materials Science & Engineering, HongIk University)
- Published : 2004.11.01
Abstract
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