Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)
- 2004.11a
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- Pages.24-24
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- 2004
Effects of cooling rates on Material Behaviors of Solder Alloys
- Hwang Tae-Kyung (Computer Aided Reliability Evaluation Laboratory Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology) ;
- Lee Soon-Bok (Computer Aided Reliability Evaluation Laboratory Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology)
- Published : 2004.11.01
Abstract
Keywords
- lead-free solder;
- Sn-Ag-Cu;
- Sn-Cu;
- microstructure;
- cooling rates;
- Young;
- s modulus tensile properties