Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)
- 2004.11a
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- Pages.15-15
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- 2004
(Solder Reflow Process induced Residual Warpage Measurement and Its Influence on Reliability of Flip-Chip Electronic Packages)
소더 Reflow시 발생하는 잔류 휨 양상의 측정과 플립칩 전자 패키지 신뢰성에 미치는 영향
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