한국마이크로전자및패키징학회:학술대회논문집 (Proceedings of the International Microelectronics And Packaging Society Conference)
- 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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- Pages.165-180
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- 2004
Performance and Reliability Issues of Flip Chip Joints
초록
Phosphor contents are critical to the interfacial reaction and IMC behavior. - If content is too low, the dissolution rate will be very fast. - If content is too much, the cracks during interfacial reaction and the IMCs spalling will easily occur. The spalling of IMCs caused the brittle fracture of solder joint under shear test. IMCs from chemical reaction influences to the mechanical properties and life time. Composition changes from chemical reaction influence to the life time.
키워드