한국마이크로전자및패키징학회:학술대회논문집 (Proceedings of the International Microelectronics And Packaging Society Conference)
- 한국마이크로전자및패키징학회 2004년도 국제표면실장 및 인쇄회로기판 생산기자재전:전자패키지기술세미나
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- Pages.37-59
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- 2004
PCB Pad finish 방법에 따른 solder의 Board level joint reliability
Board level joint reliability of differently finished PWB pad
- 이왕주 (삼성전자(주)) ;
- ;
- Lee W. J. (Interconnect Product & Technology Development Team Samsung Electronics Co., Ltd.) ;
- Moon H. J. (Interconnect Product & Technology Development Team Samsung Electronics Co., Ltd.) ;
- Kim Y. H. (Interconnect Product & Technology Development Team Samsung Electronics Co., Ltd.)
- 발행 : 2004.02.01
초록
In the case of Ni/Au finished pad on the package side, the solder joint of SnAgCu system can bring brittle fracture under impact load such as drop test. Therefore, it's difficult to prevent the brittle fracture of lead-free solder, by controlling Cu content. The failure locus existing on the interface between
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