Micro-drilling of Fused Silica by Laser Induced Wet Etching

레이저습식각을 이용한 용융실리카의 미세구멍가공

  • 백병선 (인덕대학 산업기술연구소) ;
  • 이종길 (한국산업기술대학교 기계공학과) ;
  • 전병희 (인덕대학 컴퓨터응용 기계계열)
  • Published : 2003.04.23

Abstract

It is generally known to be difficult to etch a surface of a transparent material such as fused silica by conventional laser ablation in which the surface is simply irradiated with a laser beam. A lot of studies have been done to provide a method capable of efficiently etching transparent materials without defects such as cracks. One of the promising methods or the micro-machining of optically transparent materials is laser induced etching. In this study, micro-drilling of fused silica by laser induced wet etching was conducted. KrF excimer and YAG laser were used as light sources. Acetone solution pyrene and ethanol solution of rhodamine were used as etchant.

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