Proceedings of the Korea Electromagnetic Engineering Society Conference (한국전자파학회:학술대회논문집)
- 2003.11a
- /
- Pages.178-182
- /
- 2003
The fabrication of the embedded inductor in the PCB for high integration
고집적화를 위한 PCB에 내장된 인덕터의 제작
- Yun, Seok-Chul (Graduate school of information and communications, Hanbat National University) ;
- Song, Il-Jong (Samsung Advanced Institute of Technology) ;
- Nam, Kuang-Woo (Samsung Advanced Institute of Technology) ;
-
Sim, Dong-Ha
(Samsung Advanced Institute of Technology)
;
- Song, In-Sang (Samsung Advanced Institute of Technology) ;
- Lee, Youn-Seoung (Graduate school of information and communications, Hanbat National University) ;
- Kim, Hak-Sun (Graduate school of information and communications, Hanbat National University)
- 윤석출 (한밭대학교 정보통신전문대학원) ;
- 송일종 (삼성종합기술원) ;
- 남광우 (삼성종합기술원) ;
-
심동하
(삼성종합기술원)
;
- 송인상 (삼성종합기술원) ;
- 이연승 (한밭대학교 정보통신전문대학원) ;
- 김학선 (한밭대학교 정보통신전문대학원)
- Published : 2003.11.15
Abstract
This paper presents the embedded inductors in PCB (Printed Circuit Board) for PAM(Power Amplifier Module) of mobile terminations. The inductors are designed, simulated, and compared to conventional chip inductors. The Quality factor(Q) and self-resonance frequency(SRF) of the inductors are evaluated. The quality factors of the inductors are two times higher than those of the chip inductors, and the self-resonance frequency is 1.3 times higher than those of chip inductors at the inductance of 2.7 nH and 3.3 nH respectively.