한국전기전자재료학회:학술대회논문집 (Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference)

한국전기전자재료학회 (The Korean Institute of Electrical and Electronic Material Engineers)
권호 표지

PDMS 몰드를 이용한 초고온용 SiCN 구조물의 제작

Fabrication of SiCN structures using PDMS mold for high-temperature applications

  • 우형순 (동서대학교 정보시스템공학부) ;
  • 김규현 (동서대학교 응용공학부) ;
  • 정귀상 (동서대학교 정보시스템공학부)
  • 발행 : 2003.11.13
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초록

In this paper, a novel processing technique for fabrication of high-temperature MEMS based on polymer-derived SiCN microstructures is described. PDMS molds are fabricated on SU-8 photoresist using standard UV-photolithographic processes. Liquid precursors are injected into the PDMS mold. And then, the resulting solid polymer structures are crosslinked under isostatic pressure, and pyrolyzed to form a ceramic capable of withstanding over $1500^{\circ}C$. These fabricated SiCN structures would be applied for high-temperature applications, such as heat exchanger and combustion chamber.

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