한국전기전자재료학회:학술대회논문집 (Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference)
- 한국전기전자재료학회 2003년도 추계학술대회 논문집 Vol.16
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- Pages.136-139
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- 2003
구리CMP공정시 알루미나 슬러리 안정성을 위한 Hydrogen peroxide의 적용
Application of Hydrogen Peroxide for Alumina Slurry Stability in Cu CMP
- Lee, Do-Won (Chung-Ang University) ;
- Kim, Nam-Hoon (Chung-Ang University) ;
- Kim, In-Pyo (Chung-Ang University) ;
- Kim, Sang-Yong (Dongbu-Anam Semiconductor) ;
- Kim, Tae-Hyoung (Yeojoo Institute of Technology) ;
- Seo, Yong-Jin (Daebul University) ;
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Chang, Eui-Goo
(Chung-Ang University)
- 발행 : 2003.11.13
초록
Copper has attractive properties as a multi-level interconnection material due to lower resistivity and higher electromigration resistance as compared with Alumina and its alloy with Copper(0.5%). Among a variety of agents in Copper CMP slurry,