A study on the Internal machining of a large-diameter Stainless pipe for Semiconductor Using Experimental Design Method

실험계획법을 이용한 반도체용 대구경 스테인레스관의 내경 가공에 관한 연구

  • 김창근 (인하대학교 대학원 기계공학과) ;
  • 이은상 (인하대 기계공학부)
  • Published : 2003.10.01

Abstract

This paper describes the characteristic of a large-diameter pipe to obtain smooth surface using Electropolishing after grinding using a non-woven fabric. Grinding using a non-woven fabric is possible under lower load and fine effect comparing with Wheel grinding. Also, the ion from the surface of the metal is eliminated by means of an electrical potential and current in Electropolishing. Electropolishing is used for leveling the surface, improving the physical appearance of the part, promoting corrosion properties and reducing contamination and adhesion of the surface. Therefore, the aim of the present study is to investigate the internal machining of a large-diameter pipe for semiconductor using experimental design method.

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