대한용접접합학회:학술대회논문집 (Proceedings of the KWS Conference)

대한용접접합학회 (The Korean Welding and Joining Society)
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유도가열에 의한 BGA 솔더 범프의 접합특성에 관한 연구

Joining characteristics of BGA solder bump by induction heating

  • 방한서 (조선대학교 선박해양공학과) ;
  • 박현후 (조선대학교 선박해양공학과 대학원)
  • 발행 : 2003.11.01
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초록

The characteristic of induction heating solder bump(solder ball: Sn-37Pb, Sn-3.5Ag, Sn-3.0Ag-0.5Cu) has analyzed in this paper. The initial condition of induction heating depends on the time and current. The shape of lead-free solder bump is better than lead solder. The shear strength of lead solder bump has decreased with aging time. The average of shear strength of solder bump is about 10N, 11N, and 11N respectively. The lead-free solder bump's shear strength is better than lead solder and varies irregularly with aging time.

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