Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)
- 2003.11a
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- Pages.247-250
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- 2003
Analysis of Crack Induced in Polymeric Layer
고분자 층에서 발생하는 균열 해석
Abstract
In this paper, the boundary element analysis of viscoelastic strain energy release ,ate G(t) for the cracked linear viscoelastic materials is attempted. This study proposes the G(t) equation and the calculating method of G(t) by time-domain boundary element analysis for the viscoelastic solids. The G(t) is defined as the derivative of the viscoelastic potential energy
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