한국마이크로전자및패키징학회:학술대회논문집 (Proceedings of the International Microelectronics And Packaging Society Conference)
- 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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- Pages.94-98
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- 2003
시료에 따른 Sn1.8Bi0.8Cu0.6In솔더의 미세구조
Micorstructure of Sn1.8Bi0.8Cu0.6In alloy during thermal aging
- 발행 : 2003.11.01
초록
The microstructure of Sn1.8Bi0.8Cu0.6In alloys was evaluated at various aging time. The bumps of Sn1.8Bi0.8Cu0.6In alloys after reflowed at
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