한국마이크로전자및패키징학회:학술대회논문집 (Proceedings of the International Microelectronics And Packaging Society Conference)
- 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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- Pages.63-67
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- 2003
공정조성의 SnPb 및 SnAgCu 선형 솔더의 electromigration 특성 평가
Electromigration charateristics of eutectic SnPb and SnAgCu thin stripe lines
- Yoon Min-Seung (School of Materials Science and Engineering, Seoul National University) ;
- Lee Shin-bok (School of Materials Science and Engineering, Seoul National University) ;
- Joo Young-Chang (School of Materials Science and Engineering, Seoul National University)
- 발행 : 2003.11.01
초록
Electromigration characteristics of
키워드