Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)

The Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회)
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Analysis of Sticking Coefficient in BSCCO Thin Film

BSCCO 박막의 부착계수 해석

  • Chun, Min-Woo (Dept. of Electrical & Electronic Eng., Dongshin University) ;
  • Park, Yong-Pil (Dept. of Electrical & Electronic Eng., Dongshin University)
  • 천민우 (동신대학교 전기전자공학부) ;
  • 박용필 (동신대학교 전기전자공학부)
  • Published : 2002.11.07
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Abstract

BSCCO thin films are fabricated by an ion beam sputtering method, and sticking coefficients of the respective elements are evaluated. The sticking coefficient of Bi element in BSCCO film formation was observed to show a unique temperature dependence; it was almost a constant value of 0.49 below about $730^{\circ}C$ and decreased linearly over about $730^{\circ}C$. In contrast, Sr and Ca, displayed no such remarkable temperature dependence. This behavior of the sticking coefficient was explained consistently on the basis of the evaporation and sublimation processes of $Bi_{2}O_{3}$. It was concluded that Bi(2212) thin film constructs from the partial melted Bi(2201) phase with the aid of the liquid phase of $Bi_{2}O_{3}$.

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