한국정보디스플레이학회:학술대회논문집
- 한국정보디스플레이학회 2002년도 International Meeting on Information Display
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- Pages.552-555
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- 2002
New Material Architecture and Its Process Integration for a-Si TFT Array Manufacturing
- Song, Jean-Ho (AMLCD Division, Device Solution Network, Samsung Electronics Co. Ltd.) ;
- Park, Hong-Sick (AMLCD Division, Device Solution Network, Samsung Electronics Co. Ltd.) ;
- Kim, Sang-Gab (AMLCD Division, Device Solution Network, Samsung Electronics Co. Ltd.) ;
- Cho, Hong-Je (AMLCD Division, Device Solution Network, Samsung Electronics Co. Ltd.) ;
- Jeong, Chang-Oh (AMLCD Division, Device Solution Network, Samsung Electronics Co. Ltd.) ;
- Kang, Sung-Chul (AMLCD Division, Device Solution Network, Samsung Electronics Co. Ltd.) ;
- Kim, Chi-Woo (AMLCD Division, Device Solution Network, Samsung Electronics Co. Ltd.) ;
- Chung, Kyu-Ha (AMLCD Division, Device Solution Network, Samsung Electronics Co. Ltd.)
- 발행 : 2002.08.21
초록
In order to achieve higher performance and low cost a-Si TFT-LCD panel, new material architecture and its process integration for a-Si TFT array manufacturing method were developed. Material combination of low resistant dry-etchable metal and new pixel electrode under currently adopted 4 mask process made it possible to get more-simplified manufacturing method and better device performance for the a-Si TFT-LCD application. Proposed 4 mask process architecture with optimized wet etchants and dry etching process was applicable to various devices such as notebook, monitor and TV.
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