한국정보디스플레이학회:학술대회논문집
- 한국정보디스플레이학회 2002년도 International Meeting on Information Display
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- Pages.270-274
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- 2002
Development of New COG Technique Using Eutectic Bi-Sn and In-Ag Solder Bumps for Flat Panel Display
- Kang, Un-Byoung (Div. of Materials Engineering, Hanyang University) ;
- Kim, Young-Ho (Div. of Materials Engineering, Hanyang University)
- 발행 : 2002.08.21
초록
We have developed a new COG technique using flip chip solder joining technology for excellent resolution and high quality LCD panels. Using the eutectic Bi-Sn and the eutectic In-Ag solder bumps of 50-80
키워드