Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)
- 2002.09a
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- Pages.161-180
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- 2002
Wafer Bumping Technology
- Park, Sung-Chang (MICROSCALE CO., LTD) ;
- Kyoung-Soon, Bok (MICROSCALE CO., LTD) ;
- In-Ho, Chi (MICROSCALE CO., LTD) ;
- Jina, Chung (MICROSCALE CO., LTD)
- Published : 2002.09.01
Abstract
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