Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)
- 2002.09a
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- Pages.123-139
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- 2002
Electrodeposition Technology for Semiconductor and Semiconductor Packaging
- Kazuo Kondo (Okayama University) ;
- Oh, Seung-Jin (Okayama University) ;
- Kenji Takahashi (ASET)
- Published : 2002.09.01
Abstract
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