한국마이크로전자및패키징학회:학술대회논문집 (Proceedings of the International Microelectronics And Packaging Society Conference)
- 한국마이크로전자및패키징학회 2002년도 International Symposium
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- Pages.53-68
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- 2002
New Flip Chip Attach Technology by Bumps Formed on Substrate
- Fukuoka, Yoshitaka (Worldwide Electronic Integrated Substrate Technology Inc. (Weisti))
- 발행 : 2002.09.01