Proceedings of the Materials Research Society of Korea Conference (한국재료학회:학술대회논문집)
- 2002.11a
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- Pages.87-87
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- 2002
Low temperature Cu deposition using cycles of (hfac)Cu(DMB) and isopropanol(IPA)$H_2$
(hfac)$Cu^{(I)}$ (DMB)와 Isopropanol(IPA)/$H_2$ 를 이용한 Cu 저온 증착
Abstract
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