Proceedings of the Materials Research Society of Korea Conference (한국재료학회:학술대회논문집)
- 2002.11a
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- Pages.65-65
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- 2002
Electromigration behavior of SnPb and SnAg solder for Flipchip packaging
Flipchip 패키징에서 SnPb와 SnAg 솔더의 Electromigration거동
Abstract
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