미소광부품의 3차원 미세 패턴 측정 기술 개발

Development of 3-dimensional Pattern measuring technique for Micro-Optic components

Three Dimensional measuring system using optical interference is greatly needed for semiconductor surface or optical surface. The application of this system are : MEMS product, semiconductor surfaces, optical components, precise machined surface, etc. In this paper, Interferometry based measurement system is introduced, which is nondestructive and noncontact inspection system. This system have relatively many advantage, compared with AFM/STM, SEM, Stylus, etc. The developed system can measure the surface topography with high precision and resolution, and with few seconds. And the associated software algorithm is also developed for the ultra precision 3D measuring surface. Various samples that is measured using this system is showed in the latter of this paper.