Proceedings of the Korean Society of Machine Tool Engineers Conference (한국공작기계학회:학술대회논문집)
- 2002.04a
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- Pages.660-665
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- 2002
Characteristic of Mirror Surface ELID Grinding of Large Scale Diametrical Silicon Wafer with Rotary Type Grinding Machine
로타리 연삭에 의한 대직경 Si-wafer의 ELID 경면 연삭특성
Abstract
Mirror surface finish of Si-wafers has been achieved by rotary in-feed machining with cup-type wheels in ELID grinding. But the diameter of the workpiece is limited with the diameter of grinding wheel in the in-feed machining method. In this study, grinding experiments by the rotary surface grinding machine with straight type wheels ware conducted, by which the possible grinding area of the workpiece is independent of the diameter of the wheels. For the purpose of investigating the grinding characteristics of large scale diametrical silicon wafer, grinding conditions such as rotation speed of grinding wheels and revolution of workpieces are varied, and grinding machine used in this experiment is rotary type surface grinding n/c equipment with an ELID wit. The surface ground using the SD8000 wheels showed that mirror like surface roughness can be attained near 2 - 6 nm in Ra.
Keywords
- Large scale diametrical silicon wafer;
- ELID(Electrolytic In-Process Dressing);
- Mirror like surface;
- Surface integrity;
- Micro-structure
- 대직경 실리콘 웨이퍼;
- 전해인프로세스 드레싱;
- 경면;
- 표면성상;
- 미세조직;