한국마이크로전자및패키징학회:학술대회논문집 (Proceedings of the International Microelectronics And Packaging Society Conference)

한국마이크로전자및패키징학회 (The Korean Microelectronics and Packaging Society)
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LTCC 기판의 Particle Size 에 따른 Ag-Pd 전극의 Soldering 특성 변화

Soldering characteristics of Ag-Pd electrodes in relationship to differing particle size of LTCC substrate

  • 조현민 (전자부품연구원 고주파재료연구센터) ;
  • 유명재 (전자부품연구원 고주파재료연구센터) ;
  • 박종철 (전자부품연구원 고주파재료연구센터)
  • 발행 : 2002.05.01
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초록

Solder leaching resistance of the metal electrode is an important factor with regard to adhesion properties of ceramic substrate. In the Low Temperature Co-fired Ceramics (LTCC), Ag-Pd or Ag-Pt pastes are used instead of pure Ag paste to prevent leaching. Solder leaching behavior of the Ag-Pd paste in relation to LTCC raw material powder size was investigated. First fabrication of LTCC green tape with different particle size was done. LTCC substrates with Ag-Pd electrode were prepared using conventional multilayer ceramic process. Dipping test was performed to test solder leaching behavior of the electrode. Ag-Pd electrode on LTCC substrate with smaller particle size achieved higher solder leaching resistance.

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