한국마이크로전자및패키징학회:학술대회논문집 (Proceedings of the International Microelectronics And Packaging Society Conference)
- 한국마이크로전자및패키징학회 2002년도 춘계 기술심포지움 논문집
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- Pages.1-6
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- 2002
Current Status of Semiconductor and Microelectronic Packaging Technology Development in Korea
- Sun, Yong-Bin (Graduate School of Industrial Technology and Information, Kyonggi University)
- 발행 : 2002.05.01
초록
It is very important to foresee the main stream of technology development in the future. Packaging related manufacturers in equipment and materials focused their strength on products sharing big portion of world markets. As a result, domestic supply sources for packaging materials and equipment has been increased, but the manufacturer's capital and manpower is so limited to develop high technology machinery and high functional materials. The current status of packaging infrastructures in Korea is reviewed statistically. The hot issues in packaging arena are now in wafer level packaging, 3D packaging, and ultra-thin packaging. In addition, the recent advancement in microelectronics packaging technology is also covered.
키워드