소프트 다이 플레이트를 이용한 미세 구멍 펀칭 연구

A Study on Micro Hole Punching with Soft Die Plate

  • 유준환 (서울대학교 기계항공공학부 대학원) ;
  • 주병윤 (서울대학교 기계항공공학부 대학원) ;
  • 전병희 (인덕대학 컴퓨터응용설계) ;
  • 오수익 (서울대학교 기계항공공학부)
  • 발행 : 2002.02.01

초록

In micro hole punching process, it is very difficult to align punch with die hole. Misalignment can cause a falling-on in hole quality and breakage of punch and die. Micro punching using soft die plate without a die hole has a big advantage because it is not necessary to align punch with die hole and to consider die clearance. Soft die plates are made by polymers or hard rubbers which are softer than metals. In this study, several micro punching experiments are conducted. Micro punching test with some materials shows that micro hole punching is feasible with some soft die plates. Through the section shape obtained by mounting and polishing, the punched hole quality is measured and the shapes of burr and dome we studied.

키워드