Proceedings of the KIEE Conference (대한전기학회:학술대회논문집)
- 2002.07c
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- Pages.1972-1975
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- 2002
LTCC-Based Packaging Technology for RF MEMS Devices
LTCC를 이용한 RF MEMS 소자의 실장법
- Hwang, Kun-Chul (School of Electrical Engineering and Computer Science, Seoul National University) ;
- Park, Jae-Hyoung (School of Electrical Engineering and Computer Science, Seoul National University) ;
- Baek, Chang-Wook (School of Electrical Engineering and Computer Science, Seoul National University) ;
- Kim, Yong-Kweon (School of Electrical Engineering and Computer Science, Seoul National University)
- Published : 2002.07.10
Abstract
In this paper, we have proposed low temperature co-fired ceramic (LTCC) based packaging for RF MEMS devices. The packaging structure is designed and evaluated with 3D full field simulation. 50