Characteristics of BSCCO Thin Film by Layer-by-layer Deposition

순차 스퍼터 법에 의한 BSCCO 박막의 특성

  • 이희갑 (대한상공회의소) ;
  • 박용필 (동신대학교 전기전자공학부) ;
  • 김귀열 (한국기술교육대학교 정보기술공학부) ;
  • 오금곤 (조선대학교 전기공학과) ;
  • 최운식 (대불대학교 전기전자공학과) ;
  • 조춘남 (광운대학교 전기공학과)
  • Published : 2001.11.08

Abstract

$Bi_{2}Sr_{2}CuO_{x}$(Bi-2201) thin films were fabricated by atomic layer-by-layer deposition using an ion bearn sputtering method. 10 wt% and 90 wt% ozone mixed with oxygen were used with ultraviolet light irradiation to assist oxidation. At early stages of the atomic layer by layer deposition. two dimensional epitaxial growth which covers the substrate surface would be suppressed by the stress and strain caused by the lattice misfit. then three dimensional growth takes place. Since Cu element is the most difficult to oxidize. only Sr and Bi react with each other predominantly. and forms a buffer layer on the substrate in an amorphous-like structure. which is changed to $SrBi_{2}O_{4}$ by in-situ anneal.

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