Temperature Distribution of an Air-Cooled PCB Mounted with Finned and Finnless Modules

휜이 부착된 강제 공랭 모듈을 실장한 기판의 온도분포에 관한 연구

  • 신대종 (금오공과대학교 대학원) ;
  • 박상희 (금오공과대학교 기계공학부) ;
  • 이인태 (금오공과대학교 대학원)
  • Published : 2001.06.27

Abstract

An experimental study was performed to investigate adiabatic wall temperature and heat transfer coefficient around on a module with longitudinal fin heat sink cooled by forced air flow. In the first method, inlet air flow(1-7m/s) and input power(3-5W) was varied after a heated module were placed on an adiabatic floor($320{\times}550{\times}1mm^{3}$). An adiabatic wall temperature was determinated to use liquid crystal film(LCF). In the second method to determinate heat transfer coefficient, inlet air flow(1-7m/s) and the heat flux of rubber heater($0.031-0.062\;W/cm^{2}$) was varied after an adiabatic module was placed on rubber heater covering up an adiabatic floor. In addition, surface oil-film visualization were performed to characterize the macroscopic flow-field around a module.

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