대한전자공학회:학술대회논문집 (Proceedings of the IEEK Conference)
- 대한전자공학회 2001년도 하계종합학술대회 논문집(2)
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- Pages.133-136
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- 2001
공진현상 감소를 위한 집적회로 패키지 설계 및 모델링
Integrated Circuit(IC) Package Analysis, Modeling, and Design for Resonance Reduction
초록
A new package design method to reduce resonance effect due to an IC package is represented. Frequency-variant circuit model of the power/ground plane was developed to accurately reflect the resonance. The circuit model is benchmarked with a full wave simulation, thereby verifying its accuracy. Then it was shown that the proposed technique can efficiently reduce the resonance due to the IC package.
키워드