Printed Circuit Board Technology Roadmap 2001 in Japan

  • Utsunomiya, Henry H. (Interconnection Technologies, Inc.)
  • Published : 2001.09.01

Abstract

Fine Pitch Technology will be accelerated among next decade. Buildup Technology is Key Technology for High Density Interconnection. Novel Base Material is critical for High Speed, Area Array Flip Chip Application. Japanese PWB Technology Roadmap will be Published soon.

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