Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)
- 2001.09a
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- Pages.71-85
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- 2001
Package Design Considerations for High Speed IC
- Park, Doo-Hyun (Design & Simulation Team, R&D Center Amkor Technology Korea)
- Published : 2001.09.01
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