Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)
- 2001.11a
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- Pages.134-137
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- 2001
Curing Kinetics of the No-Flow Underfill Encapsulant
- Jung, Hye-Wook (Department of Chemical Engineering, Pusan National University) ;
- Han, Sang-Gyun (Department of Chemical Engineering, Pusan National University) ;
- Kim, Min-Young (Department of Chemical Engineering, Pusan National University) ;
- Kim, Won-Ho (Department of Chemical Engineering, Pusan National University)
- Published : 2001.11.01
Abstract
The cure kinetics of a cycloalipatic epoxy / anhydride / Co(II) system for a no-flow underfill encapsulant, has been studied by using a differential scanning calorimetry(DSC) under isothermal and dynamic conditions over the temperature range of
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