한국마이크로전자및패키징학회:학술대회논문집 (Proceedings of the International Microelectronics And Packaging Society Conference)

한국마이크로전자및패키징학회 (The Korean Microelectronics and Packaging Society)
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Curing Kinetics of the No-Flow Underfill Encapsulant

  • Jung, Hye-Wook (Department of Chemical Engineering, Pusan National University) ;
  • Han, Sang-Gyun (Department of Chemical Engineering, Pusan National University) ;
  • Kim, Min-Young (Department of Chemical Engineering, Pusan National University) ;
  • Kim, Won-Ho (Department of Chemical Engineering, Pusan National University)
  • 발행 : 2001.11.01
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초록

The cure kinetics of a cycloalipatic epoxy / anhydride / Co(II) system for a no-flow underfill encapsulant, has been studied by using a differential scanning calorimetry(DSC) under isothermal and dynamic conditions over the temperature range of $160^{\circ}C ~220^{\circ}C$. The kinetic analysis was carried out by fitting dynamic/isothermal heating experimental data to the kinetic expressions to determine the reaction parameters, such as order of reaction and reaction constants. Diffusion-controlled reaction has been observed as the cure conversion increases and successfully analyzed by incorporating the diffusion control term into the rate equation. The prediction of reaction rates by the model equation corresponded well to experimental data at all temperature.

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