한국마이크로전자및패키징학회:학술대회논문집 (Proceedings of the International Microelectronics And Packaging Society Conference)
- 한국마이크로전자및패키징학회 2001년도 추계 기술심포지움
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- Pages.67-73
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- 2001
A:V Ratio 변화에 따른 Sn-37Pb, Sn-4.0Ag-0.5Cu Solder 접합부의 특성 연구
A Study on Characteristics of Sn-37Pb and Sn-4.0Ag-0.5Cu Solder Joints as Various A:V Ratio
- 발행 : 2001.11.01
초록
To investigate the relationships of solder joint characteristics with solder composition and A:V ratio (solder volume per pad area), Sn-37Pb and Sn-4.0Ag-0.5Cu solder balls with 330, 400, 450 and
키워드