The Prediction of Defection for the Shape Fixability on the Stamped Lead Frame

반도체 리드프레임의 형상 동결성에 관한 연구

IC lead frame needs the precision shape for good efficiency. In the blanking process, there are many parameter effected the dimensional accuracy : lead width, blanking order, striper force, tool clearance etc. In this research, the4 undesirable defects appeared in the final blanking process. so we measured the deflection of lead according to the stripper force using $PAM-STAMP_{TM}$. In the result, the deflection was decreased by increasing the stripper force properly. and we changed the blanking order on the test model. In the blanking order, deflection is good from the outer line position blanking to center line position. so we can design the precision die without tryout by the prediction of the lead deflection.