미세 유체통로를 이용한 대면적 평판 구조의 부양에 관한 연구

Study on the Micro Channel Assisted Release Process

  • 김재흥 (서울대학교 전기컴퓨터공학부) ;
  • 이준영 (서울대학교 전기컴퓨터공학부) ;
  • 김용권 (서울대학교 전기컴퓨터공학부)
  • Kim, Che-Heung (School of Electrical Engineering and Computer Science, Seoul National University) ;
  • Lee, June-Young (School of Electrical Engineering and Computer Science, Seoul National University) ;
  • Kim, Yong-Kweon (School of Electrical Engineering and Computer Science, Seoul National University)
  • 발행 : 2001.07.18

초록

A novel wet release process ($\mu$ CARP - Micro Channel Assisted Release Process) for releasing an extreme large-area plate structure without etching hole is proposed and experimented. Etching holes in conventional process reduce a effective area and degrade an optical characteristics by a diffraction. In addition, as the area of a released structure increases, the stietion becomes more serious. The proposed process resolves these problems by the introduction of a micro fluidic channel beneath the structure which will be released. In this paper, a 5 mm${\times}$5mm-single crystal silicon plate structure was released by the proposed $\mu$CARP without etch holes on the structure. The variation in etching time with respect to the of the introduced micro channel is also examined. This process is expected to be beneficial for the actuator of a nano-scale data storage and the scanning mirror.

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