한국마이크로전자및패키징학회:학술대회논문집 (Proceedings of the International Microelectronics And Packaging Society Conference)
- 한국마이크로전자및패키징학회 2000년도 2nd Korea-Japan Advanceed Semiconductor Packaging Technology Seminar
- /
- Pages.105-129
- /
- 2000
Au-Au Flip Chip Mounting Technology by NEC
- Hino, Shigekazu (Advanced Assembly Technologies Development Group Semiconductor Div. NEC Kansai Ltd)
- 발행 : 2000.10.01