Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)
- 2000.10a
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- Pages.77-95
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- 2000
High Density Processing for Flip Chip Package
- Shoichi-Koyama (Shinko electric industries CO. LTD. Materials & process research Dept) ;
- Wakabayashi, Shin-ich (Shinko electric industries CO. LTD. Materials & process research Dept)
- Published : 2000.10.01
Abstract
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