한국마이크로전자및패키징학회:학술대회논문집 (Proceedings of the International Microelectronics And Packaging Society Conference)
- 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
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- Pages.80-80
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- 2000
New Fabrication Method of Solder Ball for Micro BGA package
- Ko, H-S. (Materials Science & Engineering Divisions) ;
- Chang, J-Y (Materials Science & Engineering Divisions) ;
- Yoo, M-K (Materials Science & Engineering Divisions) ;
- Moon, I-G (Materials Science & Engineering Divisions)
- 발행 : 2000.04.01