한국마이크로전자및패키징학회:학술대회논문집 (Proceedings of the International Microelectronics And Packaging Society Conference)
- 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
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- Pages.3-7
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- 2000
System-on-Package (SOP) Vision, Status and Challenges
- Tummala, Rao R. (NSF Packaging Research Center, Georgia Institute of Technology)
- 발행 : 2000.04.01
초록
In summary, a fundamentally new paradigm called System-on-Package could potentially become a complementary alternative to System-on-Chip, thus providing a balanced set of system-level functions between the semiconductor IC and single component package beyond the year 2007. The concurrent engineering and optimization of IC and package could overcome the fundamental IC issues presented above.
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